Design and Development of Electronic Modules

The unique production ensures the manufacture of electronic modules using compo-nents of surface and pin mounting in plastic, ceramic and metal packages of from 0402 (1 mm x 0.5 mm) to BGA 55 mm х 55 mm (the pitch is 0.4 mm, the mass is up to 25 g), of domestic and foreign origin. The mounting accuracy is no worse than 17.0 mm at Sigma 6.

The production meets the requirements of standards for protection against static elec-tricity and electronic hygiene.

The engineering process of serial production is based on two computer-aided lines for mounting and soldering of SMD components, equipped with high-performance, high-precision devices, testing facilities and controls. The computer-aided lines enable mounting at the rate of 45,000 components per hour all in total. The mounting is per-formed on PCBs of the size from 50 mm x 50 mm to 460 mm x 460 mm.

The computer-aided SMT line includes:

• computer-aided FIFO depot;
• technological system for forming, tinning and trimming of element pins;
• high-precision automatic stencil-print machine to put solder cream or glue;
• automatic machines to put SMD elements;
• conveyor-type oven to solder SMD elements;
• machine for computer-aided optical check of mounting quality;
• equipment for parametric testing of assembled products.

The production-engineering cycle is ensured by a laser-cutting machine for patterns by ‘HAAS Laser’ at the accuracy of 1 µm. The machine enables the manufacture of a pat-tern to put solder creams and glues when the maximum dimensions are 500 mm x 600 mm.

The computer-aided depot by ‘Kardex’ enables gathering and output of elements for mounting as per specifications and job time-table in accordance with the FIFO System.

The forming and trimming of pin components are performed using a technological sys-tem by ‘Streckfuss’, Germany.

The lines for the mounting and soldering of SMD components are equipped with the following:

• machines for stencil-printing by ‘EKRA’, Germany, which ensure putting of solder cream or glue at the accuracy of PCB and stencil overlapping of +/-15 mm;;
• SIPLAСE machines to put SMD components by ‘Siemens’;
• convection ovens by ‘Seho’ и ‘Rehm’ for fusing of solder cream and polymerization of glue in inert-gas (nitrogen) environment. The ovens enable soldering according to both lead and lead-free technology. The central support of PCBs inside the ovens prevents the bending of large-size PCBs at peak-temperature values.

The machine for computer-aided optical check by ‘VISCOM’ enables the inspection of electronic products at high component-density, resolution of up to 23.4 ?m, and rate of 20 cm/s.

The line for mounting and soldering of elements with pin outputs is equipped with semi-automatic mounting blocks ‘Royonic’ and a machine for double-wave soldering by ‘SEHO’ in inert-gas (nitrogen) environment. The microprocessor control-system ensures computer-aided control of soldering process and display of all the data onto the monitor.

The soldering convection system of TF-series by ‘PACE’ enables the mounting and dismounting of different-type circuits as well as the recovery of integrity of circuit outputs in BGA packages.

The semi-automatic machines by ‘Fritsch’ enable the mounting of SMD components for pilot and single-piece products at the high quality-level during mounting of complex components.

The parametric testing of finished products is carried out by the ‘MDA plus’ System by ‘Spea’.

The minimum document package for software preparation is as follows:

• assembly drawing;
• specification of elements;
• PCB-file.